我們是AGM的長(zhǎng)期授權(quán)代理商，可以為用戶提供最具競(jìng)爭(zhēng)力的價(jià)格與技術(shù)支持服務(wù)。
功能替換 Altera Xilinx Lattice MicroSemi FPGA：
AG16KSDE176/AG16KSDE176G
Altera：EP3C16 EP4CE15
Xilinx：XC3S700 XC6SLX16
Lattice：LFXP2-17E
MicroSemi：M2S005 M2S010
AG16K(+MCU) device
FPGA+MCU SoC family device, integrates high performance FPGA logic with low-power MCU core in a single die one silicon, targets consumer and industrial's mass-volume market with low-cost and high-performance SoC. The device features integrated rich functions with 16K LUTs and MCU core with 250MHz.
AG16K SoC
(MCU+FPGA+SDRAM) device
AG16K SoC is AG16K(MCU) SoC bonded with 64MBit 32-bit 166MHz SDRAM die . EQFP-176 and FBGA-256 package is provided as industrial grade, E176 package is pin-to-pin compatible with AG10KSDE176(MCU).
FPGA logic fabric is embedded within MCU hard-IP system, and all mcu internal IOs are connectable to device's IO pad, and/or internal FPGA's logic as user demands. MCU core, with usable code space up to 128 KByte RAM, is programmable through spiflash, and JTAG for testing purposes.
AG16KSDE176/AG16KSDF256/AG16KSDE176G devices are AG16K FPGA bonded with 64MBit 32-bit 166MHz SDRAM :
- AG16KSDE176, QFP-176 papckage suppports 2-layer PCB(cost-down) design. AG16KSDE176 is pin-to-pin compatible with AG10KSDE176.
- AG16KSDF256, FBGA-256 package supports 152 user IOs and 3 additional ADC IO.
- AG16KSDE176G, QFP-176 package suppports 2-layer PCB(cost-down) design, with 139 user IOs.
AG16KDDF256 device is AG16K FPGA bonded with 128MBits 16-bit 200MHz DDR-SDRAM, FBGA-256 package supports 170 user IOs.
AGM(遨格芯)2012年起步于僅是 FPGA IP 軟核和軟件授權(quán)公司, 2014年轉(zhuǎn)入芯片業(yè)務(wù)，CPLD芯片已經(jīng)成熟，并且開始在行業(yè)有了一些應(yīng)用，看到智能手機(jī)風(fēng)口的AGM也不失時(shí)機(jī)出了一款用于智能手機(jī)和loT的FPGA芯片，并且通過(guò)了三星嚴(yán)格的供應(yīng)商測(cè)試認(rèn)證，成為三星Galaxy手機(jī)里除Lattice之外的唯一備選FPGA器件，實(shí)現(xiàn)了國(guó)內(nèi)FPGA公司出口零的突破，具有特殊的戰(zhàn)略意義。
AGM在軟件和電路上擁有自主知識(shí)產(chǎn)權(quán)，在產(chǎn)品方面目前走的是兼容主流大廠并軟硬件生態(tài)不變的路線，在芯片內(nèi)部接口兼容主流廠商器件，PCB板級(jí)可以直接替換并用AGM編譯軟件導(dǎo)入燒寫，AGM目前供貨器件可以直接替換：
CPLD系列，針對(duì)Altera MAX II系列，包括EPM240T100，EPM570T144，EPM570T100
低端FPGA SoC系列，針對(duì)Altera Cyclone III 系列FPGA：EP3C5E、EP3C5F、EP3C10E、EP3C10F、EP3C16F； Cyclone IV 系列FPGA：EP4CE6、EP4CE10、EP4CE15
高端FPGA SoC系列BlueWind，針對(duì)Xilinx Virtex系列。
以下是替代列表：
綠色料號(hào)，直接PINtoPIN，不需要重新畫板、打板，也不需要重新編程。
包裝規(guī)格：
