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XCZU21DR-2FFVD1156E芯片詳細(xì)信息
- Manufacturer Part Number:
XCZU21DR-2FFVD1156E
- Rohs Code:
Yes
- Part Life Cycle Code:
Active
- Package Description:
FCBGA-1156
- Reach Compliance Code:
compliant
- ECCN Code:
5A002.A.4
- HTS Code:
8542.39.00.01
- Date Of Intro:
2017-12-19
- Manufacturer:
Xilinx
- Risk Rank:
5.81
- JESD-30 Code:
R-PBGA-B1156
- JESD-609 Code:
e1
- Moisture Sensitivity Level:
4
- Number of Terminals:
1156
- Operating Temperature-Max:
100 °C
- Package Body Material:
PLASTIC/EPOXY
- Package Code:
BGA
- Package Shape:
RECTANGULAR
- Package Style:
GRID ARRAY
- Peak Reflow Temperature (Cel):
NOT SPECIFIED
- Supply Voltage-Max:
0.876 V
- Supply Voltage-Min:
0.825 V
- Supply Voltage-Nom:
0.85 V
- Surface Mount:
YES
