線路板(PCB)流程術(shù)語中英文對照
流程簡介：開料－－鉆孔－－干膜制程－－壓合－－減銅－－電鍍－－塞孔－－防焊(綠漆/綠油)
????????? －－鍍金－－噴錫－－成型－－開短路測試－－終檢－－雷射鉆孔
A. 開料( Cut Lamination)
a-1 裁板( Sheets Cutting)
a-2 原物料發(fā)料(Panel)(Shear material to Size)
B. 鉆孔(Drilling)
b-1 內(nèi)鉆(Inner Layer Drilling )
b-2 一次孔(Outer Layer Drilling )
b-3 二次孔(2nd Drilling)
b-4 雷射鉆孔(Laser Drilling )(Laser Ablation )
b-5 盲(埋)孔鉆孔(Blind & Buried Hole Drilling)
C. 干膜制程( Photo Process(D/F))
c-1 前處理(Pretreatment)
c-2 壓膜(Dry Film Lamination)
c-3 曝光(Exposure)
c-4 顯影(Developing)
c-5 蝕銅(Etching)
c-6 去膜(Stripping)
c-7 初檢( Touch-up)
c-8 化學(xué)前處理,化學(xué)研磨( Chemical Milling )
c-9 選擇性浸金壓膜(Selective Gold Dry Film Lamination)
c-10 顯影(Developing )
c-11 去膜(Stripping )
Developing , Etching & Stripping ( DES )
D. 壓合Lamination
d-1 黑化(Black Oxide Treatment)
d-2 微蝕(Microetching)
d-3 鉚釘組合(eyelet )
d-4 疊板(Lay up)
d-5 壓合(Lamination)
d-6 后處理(Post Treatment)
d-7 黑氧化( Black Oxide Removal )
d-8 銑靶(spot face)
d-9 去溢膠(resin flush removal)
E. 減銅(Copper Reduction)
e-1 薄化銅(Copper Reduction)
F. 電鍍(Horizontal Electrolytic Plating)
f-1 水平電鍍(Horizontal Electro-Plating) (Panel Plating)
f-2 錫鉛電鍍( Tin-Lead Plating ) (Pattern Plating)
f-3 低于1 mil ( Less than 1 mil Thickness )
f-4 高于1 mil ( More than 1 mil Thickness)
f-5 砂帶研磨(Belt Sanding)
f-6 剝錫鉛( Tin-Lead Stripping)
f-7 微切片( Microsection)
G. 塞孔(Plug Hole)
g-1 印刷( Ink Print )
g-2 預(yù)烤(Precure)
g-3 表面刷磨(Scrub)
g-4 后烘烤(Postcure)
H. 防焊(綠漆/綠油): (Solder Mask)
h-1 C面印刷(Printing Top Side)
h-2 S面印刷(Printing Bottom Side)
h-3 靜電噴涂(Spray Coating)
h-4 前處理(Pretreatment)
h-5 預(yù)烤(Precure)
h-6 曝光(Exposure)
h-7 顯影(Develop)
h-8 后烘烤(Postcure)
h-9 UV烘烤(UV Cure)
h-10 文字印刷( Printing of Legend )
h-11 噴砂( Pumice)(Wet Blasting)
h-12 印可剝離防焊(Peelable Solder Mask)
I . 鍍金Gold plating
i-1 金手指鍍鎳金( Gold Finger )
i-2 電鍍軟金(Soft Ni/Au Plating)
i-3 浸鎳金( Immersion Ni/Au) (Electroless Ni/Au)
J. 噴錫(Hot Air Solder Leveling)
j-1 水平噴錫(Horizontal Hot Air Solder Leveling)
j-2 垂直噴錫( Vertical Hot Air Solder Leveling)
j-3 超級焊錫(Super Solder )
j-4. 印焊錫突點(diǎn)(Solder Bump)
K. 成型(Profile)(Form)
k-1 撈型(N/C Routing ) (Milling)
k-2 模具沖(Punch)
k-3 板面清洗烘烤(Cleaning & Backing)
k-4 V型槽( V-Cut)(V-Scoring)
k-5 金手指斜邊( Beveling of G/F)
L. 開短路測試(Electrical Testing) (Continuity & Insulation Testing)
l-1 AOI 光學(xué)檢查( AOI Inspection)
l-2 VRS 目檢(Verified & Repaired)
l-3 泛用型治具測試(Universal Tester)
l-4 專用治具測試(Dedicated Tester)
l-5 飛針測試(Flying Probe)
M. 終檢( Final Visual Inspection)
m-1 壓板翹( Warpage Remove)
m-2 X-OUT 印刷(X-Out Marking)
m-3 包裝及出貨(Packing & shipping)
m-4 目檢( Visual Inspection)
m-5 清洗及烘烤( Final Clean & Baking)
m-6 護(hù)銅劑(ENTEK Cu-106A)(OSP)
m-7 離子殘余量測試(Ionic Contamination Test )(Cleanliness Test)
m-8 冷熱沖擊試驗(yàn)(Thermal cycling Testing)
m-9 焊錫性試驗(yàn)( Solderability Testing )
N. 雷射鉆孔(Laser Ablation)
N-1 雷射鉆Tooling孔(Laser ablation Tooling Hole)
N-2 雷射曝光對位孔(Laser Ablation Registration Hole)
N-3 雷射Mask制作(Laser Mask)
N-4 雷射鉆孔(Laser Ablation)
N-5 AOI 檢查及VRS ( AOI Inspection & Verified & Repaired)
N-6 Blaser AOI (after Desmear and Microetching)
N-7 除膠渣(Desmear)
N-8 微蝕(Microetching )
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