基于ADμC 812 的芯片溫度控制系統(tǒng)的研究

介紹了一種以PID增量算法為核心,以ADμC 812為硬件基礎(chǔ)的溫度控制系統(tǒng)，并給出
了硬件電路和軟件設(shè)計的總體結(jié)構(gòu)。采用模擬軟件COMSOL Multiphysics 3.2 分析控制對象的溫度分布能夠使控制結(jié)果與實際要求更為符合，滿足芯片培養(yǎng)細胞的需要。
關(guān)鍵詞：溫度控制；ADμC 812；PID；COMSOL Multiphysics
Chip Temperature Control System Based on ADμC812 Yang Cai-Biao1, 2 , Zhao Jian-Long1
1． Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences, Shanghai 200050, China 2． Graduate School of the Chinese Academy of Sciences, Beijing 100049, China Abstract: Introduced a temperature control system based on ADμC 812 and PID increment arithmetic, then, described the architecture of hardware and software. Temperature distribution of the heated objected is analyzed by the simulation software COMSOL Multiphysics 3.2 which makes the control system act in conformity with requirements for cell culture.
Key Words: Temperature Control; ADμC 812; PID; COMSOL Multiphysics 3.2