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瑞薩電子(Renesas Electronics)在日本3月11日地震之后損失了大約40%的芯片生產(chǎn)能力。該公司本周表示，其出貨量在10月底以前難以恢復(fù)震前水平。
?瑞薩(東京)公布，在截止于3月31日的2011財(cái)年凈虧損1150億日?qǐng)A(約合14億美元)。虧損主要源于地震造成的破壞費(fèi)用與生產(chǎn)損失。
?地震導(dǎo)致瑞薩的一些工廠停產(chǎn)，其中多數(shù)已在幾周前至少恢復(fù)部分生產(chǎn)。但受損最嚴(yán)重的工廠——位于茨城縣的Naka工廠仍在修復(fù)之中。該工廠生產(chǎn)汽車(chē)與通用微控制器，以及SoC。
?瑞薩目前計(jì)劃6月重啟Naka工廠的部分生產(chǎn)，希望該廠生產(chǎn)的部分器件8月開(kāi)始出貨。到10月底，瑞薩希望使芯片出貨量完全恢復(fù)到地震前的水平。它采取的措施包括使用第三方代工伙伴臺(tái)積電和Globalfoundries，把一些生產(chǎn)業(yè)務(wù)轉(zhuǎn)移到瑞薩的其它工廠。Naka工廠的初制晶圓產(chǎn)量預(yù)計(jì)到7月底將恢復(fù)到震前水平。
?受地震影響而關(guān)閉的瑞薩工廠中，四家前端工廠和三家后端工廠此前已恢復(fù)生產(chǎn)。
?瑞薩在上述財(cái)年記錄了495億日?qǐng)A(約合6.06億美元)與地震相關(guān)的特別損失，其中包括431億日?qǐng)A(約合5.278億美元)廠房與設(shè)備修理費(fèi)用。該公司表示，收到了160億日?qǐng)A(約合1.959億美元)保險(xiǎn)賠付，可以幫助抵消總計(jì)超過(guò)655億日?qǐng)A(約合8.021億美元)修理與損失費(fèi)用中的一部分。瑞薩表示，Naka工廠在總體損失金額中約占85%。
?瑞薩還記錄了地震后用于結(jié)構(gòu)改革的大約670億日?qǐng)A(約合8.203億美元)特殊費(fèi)用。這些改革包括裁減大約2800名員工，其中有大約1500名通過(guò)提前退休計(jì)劃裁減，600人屬于上月出售的美國(guó)加州羅斯維爾芯片廠，大約700名員工轉(zhuǎn)移到了分銷(xiāo)商和主要持股公司。瑞薩表示，還有大約1000名員工在公司內(nèi)部各部門(mén)之間調(diào)整，以?xún)?yōu)化運(yùn)營(yíng)。
?瑞薩公布全財(cái)年?duì)I業(yè)收入為1.14萬(wàn)億日?qǐng)A(約合140億美元)，營(yíng)業(yè)利潤(rùn)為1190億日?qǐng)A(約合14.6億美元)。
?瑞薩沒(méi)有給出對(duì)當(dāng)前財(cái)年的預(yù)測(cè)，該財(cái)年截止到2012年3月底。該公司提到了地震，它說(shuō)地震“給市場(chǎng)情況帶來(lái)不確定性”。瑞薩說(shuō)，將在7月發(fā)布關(guān)于本財(cái)年的預(yù)測(cè)。
?瑞薩還宣布，因美國(guó)子公司Renesas Electronics America Inc.的股價(jià)下跌而記錄了98億日?qǐng)A(約合1.202億美元)的特別虧損。
另外據(jù)統(tǒng)計(jì)，瑞薩的 USB 3.0 主機(jī)控制器(μPD720200)之全球累計(jì)出貨量，自2009年5月推出以來(lái)，已于2011年5月19日達(dá)到3,000萬(wàn)顆；該公司宣布，為進(jìn)一步滿(mǎn)足客戶(hù)日益增加的訂單，預(yù)計(jì)自2011年6月起，其 USB 3.0 主機(jī)控制器的產(chǎn)量將提升一倍，達(dá)到每月600萬(wàn)顆。
?瑞薩電子(當(dāng)時(shí)為NEC電子公司)于2009年5月推出業(yè)界第一款USB 3.0 xHCI主機(jī)控制器，推出僅四個(gè)月之后，即成為全球第一家獲得USB-IF頒發(fā)“Certified SuperSpeed USB (USB 3.0) ”認(rèn)證之企業(yè)，并同時(shí)開(kāi)始大量生產(chǎn)μPD720200主機(jī)控制器。接下來(lái)的一年中，瑞薩又推出第二款USB 3.0 xHCI主機(jī)控制器 (μPD720200A)，并在僅僅兩個(gè)月內(nèi)通過(guò)兼容性及認(rèn)證測(cè)試。
?在推出上述組件后，2011年3月9日瑞薩電子再新增兩款USB 3.0主機(jī)控制器產(chǎn)品系列，其中一款為具有四個(gè)連接端口的新產(chǎn)品，提供了比該公司先前USB 3.0主機(jī)控制器更快的傳輸速度、更優(yōu)異的電源效率及更小的尺寸。
?瑞薩電子是世界最大的USB 3.0主機(jī)控制器制造商，并提供了完整的USB 3.0解決方案，包括適用于Windows XP、Vista及 Windows 7 的裝置驅(qū)動(dòng)程序。瑞薩電子亦授權(quán)主機(jī)端與裝置端的USB 3.0 IP ，并為希望設(shè)計(jì)及推銷(xiāo)自有USB 3.0集成電路的公司提供其自訂ASIC鏈接庫(kù)中的建構(gòu)區(qū)塊。上述所有USB 3.0主機(jī)控制器均已量產(chǎn)供貨。
Dylan McGrath
SAN FRANCISCO—Renesas Electronics Corp.—which lost an estimated 40 percent of its chip production capacity in the immediate aftermath of the March 11 earthquake in northeastern Japan—said this week that its shipments won't return to pre-earthquake levels until the end of October.
?Renesas (Tokyo) reported a net loss of 115 billion yen ($1.4 billion) for its fiscal year 2011, which closed March 31. The loss was largely due to the cost of damages and loss of production following the earthquake.
?Most of the Renesas facilities that were knocked offline in the quake and its aftermath have been back in at least partial production for several weeks. But the most heavily damaged Renesas fab, the Naka fab located in Ibaraki prefecture, is still undergoing repairs. The facility produces automotive and general-purpose microcontrollers as well as SoCs.
?Renesas' current plan is to restart partial production at the Naka fab in June. The company hopes to begin shipping some parts made at the Naka fab again in August. By the end of October, Renesas hopes to have fully restored shipments of chips to pre-earthquake levels, partly through the use of third-party foundries Taiwan Semiconductor Manufacturing Co. Ltd. and Globalfoundries Inc., and transfer of production to other Renesas fabs. Wafer starts at the Naka fab are expected to return to pre-earthquake levels by the end of July.
?Manufacturing was previously restarted at four other Renesas front-end fabs and three back-end facilities that were knocked offline by the earthquake and its aftermath.
?Renesas recorded a special loss of 49.5 billion yen ($606 million) for the fiscal year associated with damage inflicted in the earthquake. This figure includes 43.1 billion yen ($527.8 million) for repairs to facilities and equipment. The company said it received 16 billion yen ($195.9 million) in insurance money to help offset the total cost of repairs and losses, which totaled more than 65.5 billion yen ($802.1 million). Damage to the Naka fab accounted for about 85 percent of the total loss, Renesas said.
?Renesas also recorded another special loss of about 67 billion yen ($820.3 million) for structural reforms in the wake of the earthquake. These reforms included shedding about 2,800 employees, including nearly 1,500 through an early retirement program, 600 with the sale last month of its chip fab in Roseville, Calif., and the move of about 700 employees to distributors and major shareholder companies. Another roughly 1,000 employees were transferred between different divisions of the company to streamline operations, Renesas said.
?Renesas reported sales for the fiscal year of 1.14 trillion yen ($14 billion). The company reported an operating income for the fiscal year of 119 billion yen ($1.46 billion).
?Renesas did not give a forecast for the current fiscal year, which closes at the end of March 2012. The company cited the earthquake, which it said has "brought uncertainty to market conditions." Renesas said it would provide a forecast for the year in July.
?Renesas also announced that it recorded a special loss of 9.8 billion yen ($120.2 million) on the loss of valuation in shares of its U.S. subsidiary, Renesas Electronics America Inc.
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