嵌入式主板
君正集成電路
?可穿戴設備級的超低功耗 (0.07mW/MHz) ?高集成度降低整體成本 |
芯片框圖
芯片規(guī)格
CPU |
XBurst core, 1.0GHz (MIPS-based). 32KB L1 cache, 256KB L2 cache. |
X2D: Resizing, Rotating, Mirror, Color Convention and OSD etc. |
|
VPU |
Video encoder: H.264 up to D1@30fps. Video decoder: H.264, MPEG-1/2/4, VC-1, VP8, RV9, up to 720P@30fps. |
Memory |
64-bit ECC conventional and toggle NAND flash. 512B/2KB/4KB/8KB/16KB page size. |
Display |
LCD controller with OSD: TFT, SLCD, up to 1280*720@60Hz(BPP24). E-Ink controller with color engine. |
Camera |
DVP interface, up to 2048x2048. |
Audio |
Embedded audio CODEC. Digital DMIC controller. AC97/I2S/SPDIF interface for external audio codec. PCM interface, master and slave mode. |
7 channels SAR A/D controller, 12-bit resolution. |
|
On-chip Peripherals |
USB 2.0 OTG. USB 1.1 Host. MMC/SD/SDIO controller. Full-duplex UART port. Synchronous serial interface. Two-wire SMB serial interface. GMAC. |
Security |
Total 256bits OTP memory. |
Package |
BGA314, 14 x 14 x 1.4 (mm), 0.65mm pitch. |
OS |
Android 4.3 and beyond. |
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